Foxconn H61MXV LGA1155 No I/O Shield

Foxconn H61MXV V2.0 Mainstream segment MB, target to meet DDR3 platform demands of enthusiasts and gamers support LGA1155 for Intel®sandybridge processors with H61 single chipset, the H61MXV allows you to build powerful PCs on a budget. Supporting dual channel 2 DIMMs DDR3 memory up to 16GB at 1333（Overclocking), it is the best MB with DVI and VGA integrated. Gigabit LAN and 6-channel HD audio are also included on this Microsoft Vista™ certified and Windows 7 ready motherboard.


* Please Note: This is an OEM motherboard and it does not come with rear I/O shield also known as back-plate cover. This part is not needed and you can still install the board in standard ATX case.


         


Specifications:

Processor: Intel® Ivybridge/Sandybridge processors
Chipset: Intel® H61 Chipset
Front Side Bus
Memory: Dual channel DDR3 1600(IVB)/1333/1066 x 2 DIMMs, Max. 16GB
VGA on Die
Expansion Slots: 1* PCIe3.0(IVB)/2.0 x16
                         2* PCIe x1
IDE: N/A
Serial ATA(SATA)/RAID: 4* SATA II
Audio: 5.1 channel HDA
LAN: Gigabit Lan
IEEE1394: N/A
Back Panel I/O Ports:
1x PS2 KB/MS port.
1x DVI-D port
1x VGA port
1x Serial port
1x RJ45 Lan port
1x audio jack supports 3 jacks.
6x USB 2.0 ports.
Internal I/O Connectors:
1x ATX 24-Pin power conn
1x 4-pin ATX 12V power conn
1x 4-pin CPU /1x 4-pin System FAN
1x Front pannel header
1x Front Audio header
1x S/PDIF out header
1x COM header
1x CD_IN
1x Speaker header
4x SATA2 connectors
2x USB headers
1x Intruder Alarm header
1x CLR_CMOS header
1x TPM header
1x Parellel header
BIOS Features: 32Mb flash EEPROM w/ LAN boot PnP, ACPI, WfM, DMI 2.0
Form Factor: mATX form factor 9.6 inch x 7.8 inch