Foxconn H67S LGA1155 Mini-ITX DDR3 No IO
Description
Features:
- Intel® Ivybridge / Sandybridge processors, Socket LGA1155 Supports Intel® 22/32nm Hi-K CPU
- Dual channel DDR3 1600(IVB)/1333/1066 x 2 DIMMs, Max. 16GB
- 1* PCIe3.0(IVB)/2.0 x16
- 1* SATA II , 2* SATA III ,1*eSATA II6* SATAII, SATA RAID 0,1, 10
- 7.1 channel HDA, Gigabit LAN
- 10 USB 2.0 ports
- mini-ITX form factor
* Please Note: This is an OEM motherboard and it does not come with rear I/O shield also known as back-plate cover. This part is not needed and you can still install the board in standard ATX case.
Specifications:
Processor: Intel® Ivybridge/Sandybridge processors, Socket LGA1155 Max. 95W
Chipset: Intel® H67
Memory: Dual channel DDR3 1600(IVB)/1333/1066 x 2 DIMMs, Max. 16GB
VGA on Die: Integrated Intel® GMA HD graphics engine
Expansion Slots: 1* PCIe3.0(IVB)/2.0 x16
IDE: N/A
Serial ATA(SATA)/RAID: 1* SATA II + 2* SATA III + 1*eSATAII
Audio: 7.1 channel HDA
LAN: Gigabit Lan
IEEE1394: N/A
Back Panel I/O Ports:
1 x PS/2 keyboard port
1 x HDMI port
1 x DVI port
1 x eSATAII port
1 x Audio jack supports 6 jacks
1 x RJ45 LAN port
6 x USB 2.0 ports
Internal I/O Connectors:
1 x ATX 24-Pin power connector
1 x 4-pin ATX 12V power connector
1 x 4-pin CPU FAN connectors
1 x 4-pin System FAN connector
1 x Front pannel header
1 x Front Audio Header
2 x USB 2.0 connectors support additional 4 ports
1 x Serial ATAII connector
2 x Serial ATAIII connectors
1 x S/PDIF out header
1 x Speaker header
1 x COM header
BIOS Features: 64Mb flash EEPROM w/ LAN boot PnP, ACPI, WfM, DMI2.0
Standards/Manageability: PCIe 3.0, USB2.0, SMBIOS2.7
Form Factor: Mini-ITX (6.75 inch x 6.75 inch)